A new masking technology for deep glass etching and its microfluidic application

By Minqiang Bu, T. Melvin, G. Ensell, J. Wilkinson, A. Evans. 2004

176 citations recorded by the source corpus.

Subfields: Biomedical Engineering, Electrical and Electronic Engineering

View Paper: https://www.semanticscholar.org/paper/07656d62ef0af213929d06ad7e825b6f76afe0ca

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Biomedical Engineering

1. Jianmin Miao
2. Ciprian Iliescu

In Electrical and Electronic Engineering

1. Nikolaos Karadimitriou
2. S. Majid Hassanizadeh

Citations in the corpus

• On the wet etching of Pyrex glass (2008, methodology): “2 50–80 MPa (tensile) 15 min/∼100 m [11] Cr/photoresist – 1 GPa (tensile) ∼100 m (soda lime) [21,28] Cr/Au/photoresist 1/1 – 40 min/250 m [5,10,23,24] Multilayer deposition of Au (or Cr/Au) is performed to minimize the defects induced by the tensile stress of Au while the photoresist ensures a hydro”