Current and future miniature refrigeration cooling technologies for high power microelectronics

By Patrick E. Phelan, V. Chiriac, T. Lee. Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2001

187 citations recorded by the source corpus.

Subfields: Civil and Structural Engineering, Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/07024f0b202688a890124c26a9a7a695cc698908

How researchers see this paper

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In Civil and Structural Engineering

1. Dongliang Zhao
2. Gang Tan

In Materials Chemistry

1. Dongliang Zhao
2. Gang Tan

Citations in the corpus

• A review of thermoelectric cooling: Materials, modeling and applications (2014, background): “[97] reviewed current and future miniature refrigeration cooling technologies for high power microelectronics and concluded that only thermoelectric coolers are now commercially available in small sizes.”
• Two-Phase Microchannel Heat Sinks: Theory, Applications, and Limitations (2011, unknown): “Various refrigeration cooling schemes have been explored [54] [55].”