Solidification and solid state phenomena during TLP bonding of IN718 superalloy using Ni–Si–B ternary filler alloy

By M. Pouranvari, A. Ekrami, A. Kokabi. 2013

148 citations recorded by the source corpus.

Subfields: Aerospace Engineering, Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/06444c1a668df7cb8653c3c79875193b4b618e7a