Managing heat for electronics

By P. Schelling, Li Shi, Kenneth E. Goodson. 2005

239 citations recorded by the source corpus.

Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications.

Subfields: Materials Chemistry

View Paper: https://www.semanticscholar.org/paper/04c63c2f36b1a120e1e87ec0dbd83a48744a0a3c

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In Materials Chemistry

1. R. Bhatti
2. Chris Best
3. Sabuj Mallik
4. Nduka Nnamdi (Ndy) Ekere

Citations in the corpus

• Investigation of thermal management materials for automotive electronic control units (2011, background): “Moreover, the useful lifetime of electronic devices can be decreased significantly because of the large thermal stresses that occur especially at interfaces [2, 3].”
• Thermal Interface Materials - A Review of the State of the Art (2006, background): “Although this technique can potentially yield high thermal conductivity in the direction of propagation, achieving low thermal resistance between the CNTs and the interface opposing the growth surface remains a challenge [65].”