Single-phase liquid cooled microchannel heat sink for electronic packages

By Hengyun Zhang, D. Pinjala, T. Wong, K. Toh, Yogendra K. Joshi. 2005

165 citations recorded by the source corpus.

Subfields: Mechanical Engineering

View Paper: https://www.semanticscholar.org/paper/03f45c234cb3d8062b69e8b8c4e266329571c20a

How researchers see this paper

The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.

In Mechanical Engineering

1. Yoav Peles
2. Ali Kosar
3. John Richard Thome
4. Satish G. Kandlikar
5. L. Wojtan
6. Bruno Michel
7. B. Agostini
8. Matteo Fabbri

Citations in the corpus

• State of the Art of High Heat Flux Cooling Technologies (2007, background): “[ 9 ] developed a liquid-cooled microchannel heat sink made of aluminium with 21 microchannels 0.”
• Boiling heat transfer in a hydrofoil-based micro pin fin heat sink (2007, background): “As part of this endeavor, single-phase flows [1–10] and boiling flows [11– 28] have been topics of great interest.”
• A comprehensive review on microchannel heat sinks for electronics cooling (2023, background): “Zhang et al [156] designed an aluminum heat sink with a size of 15 mm in length and 12.2 mm in width and assembled it on a chip using thermal interface materials (TIMs) to reduce interfacial thermal resistance.”