A microscale model for thin-film evaporation in capillary wick structures
By R. Ranjan, Jayathi Y. Murthy, Suresh V. Garimella. 2011
213 citations recorded by the source corpus.
Subfields: Computational Mechanics, Mechanical Engineering
View Paper: https://www.semanticscholar.org/paper/027629d9e54a15acdab7e7b8babd25e060dd527f
How researchers see this paper
The researchers whose trusted networks rank it highest, strongest advocate first. Every researcher gets a different order.
In Computational Mechanics
- Suresh V. Garimella
- Guoqi Zhang
- Tianling Ren
- Xuejun Fan
- Xianping Chen
- Huaiyu Ye
- Y. Nam
- Jayathi Y. Murthy
In Mechanical Engineering
- Suresh V. Garimella
- Jayathi Y. Murthy
- Chirag R. Kharangate
- R. Ranjan
- Guoqi Zhang
- Tianling Ren
- Xuejun Fan
- Xianping Chen
Citations in the corpus
- A numerical model for transport in flat heat pipes considering wick microstructure effects (2011, methodology): “The authors previously [2,21] showed that Marangoni convection is insignificant in enhancing evaporation in wick pores, and therefore, heat transfer at this scale is determined to first order by thermal conduction.”
- A review of small heat pipes for electronics (2016, methodology): “[84, 85] developed a model to calculate the evaporating liquid meniscus in wick microstructures under saturated vapour conditions.”
- Experimental and computational investigation of vertical downflow condensation (2015, background): “(2011) [61] Film evaporation Schrage model: _ m00 1⁄4 2c 2 c ð M 2pRÞ ð Pgffiffiffiffi Tg p Pfffiffiffiffi Tf p Þ”
- Planar vapor chamber with hybrid evaporator wicks for the thermal management of high-heat-flux and high-power optoelectronic devices (2013, background): “Only pure conduction is considered in the heat transfer model as a previous study suggested that the internal convection has relatively small effects [14,15].”